Cray, Intel collaborate for future supercomputing technologies

Mumbai

April 30, 2008

Cray and Intel Corp announced that they signed a multi-year agreement to
advance high-performance computing (HPC) on Intel microprocessors while
delivering broad new Intel and Cray technologies in future Cray server systems.
The collaboration of these two industry leaders will result in HPC systems that
will help solve some of the world's most complex scientific, engineering and
humanitarian challenges.

“We're excited at the potential of bringing together Intel's powerful
silicon expertise and Cray's industry leadership in scalable HPC systems,”
said Peter Ungaro, President and CEO, Cray. “We pride ourselves in offering
the most innovative supercomputing systems and our customers will now enjoy
greater choice in processor technologies. This collaboration provides the HPC
market segment with access to the best microprocessors the industry has to offer
at any point in time, in the most advanced supercomputers in the world,”
Ungaro added.

The two companies plan to explore future supercomputer component designs such
as multi-core processing and advanced interconnects. As a result of this
collaboration, Cray and Intel plan to develop a range of HPC systems and
technologies over the next several years. “Cray's commitment to Intel is a
testament of our commitment to HPC and the strength of our hardware and software
roadmap and many-core research,” said Patrick Gelsinger, Senior VP and GM-Digital
Enterprise Group, Intel. “Throughout Cray's history, it has been an
innovator in high-end HPC while Intel has pushed the boundaries of processor
technology. The combination of this industry leadership and technical strength
will allow HPC users to take advantage of future Xeon and other Intel processor
technologies,” Gelsinger said.