Intel banks on mobility

Taipei

16 October, 2007

The Asia Pacific Intel Developer Forum (IDF), Fall 2007 took off well at the
Taipei International Convention Center in Taiwan here yesterday. With 'Multiply
Your Innovation' as the theme for this year's IDF, speakers at the
conference spoke at length on mobile, ultra-mobile and wireless technologies.

Participants at the event got to learn about how Intel's technologies would
enable the industry to capture new markets and usage model opportunities. The
developer community also got a glimpse on how to create and innovate mobility
effectively. Of the nearly 2700 attendees and 65 companies participating at the
event, it was bloggers who had a hey day since Intel for the first time provided
online blogging at the event.

Making his keynote presentation, Anand Chandrasekher, Senior VP and GM of the
Mobile Platform Group said that the need of the hour was to get various
technologies from the 'extreme' to the 'mainstream.' This, according to
him, was possible only through collaborations and partnerships. Innovation, he
said, was the key to making technologies pervasive and diffuse them into the
market.

Anand also indicated that the focus for his group at Intel was the developing
markets and India posted a huge opportunity as far as mobility and WiMAX was
concerned. He said that together with partners Intel would maximize on this
growth opportunity. Anand also said that Intel would come out with many new
products and solutions in 2008, which would be in sync with the growth in the
mobility market space.

Describing the latest trends in mobile computing, Mooly Eden, Intel VP and
GM, Mobility Platforms Group, gave a sneak peek into the forthcoming Intel
platforms for notebooks that promise better performance, battery life, have a
small form factor and provide for 'always on' connectivity. He also
discussed the future of wireless networking connectivity, including mobile WiMAX.

Mooly added that in January 2008, Intel will launch 'Santa Rosa Refresh',
an update to Intel Centrino processor technology that includes the 45nm high-k
mobile processor (codenamed Penryn) and improved graphics capabilities. Santa
Rosa Refresh notebook PCs would contain the Mobile Intel 965 Express chipset
family, Intel Next-Gen Wireless-N network connection, Intel 82566MM and 82566MC
Gigabit network connection, and optional Intel Turbo memory.

Mooly also demonstrated the Montevina processor technology, which Intel hopes
to deliver in mid-2008. Montevina includes the new 45nm high-k Intel Penryn
mobile processor and comes with DDR3 memory support. This will be Intel's
first Centrino processor technology for notebooks to offer integrated Wi-Fi and
WiMAX wireless technologies for better wireless broadband access. It will also
feature integrated HD-DVD/Blu-ray support for consumers with better data
manageability and security features for the enterprise. Montevina will be suited
for notebook designs from sub to full-sized notebooks.

Mooly also demonstrated the Intel Echo Peak, the integrated Wi-Fi / WiMAX
module solution that will be offered as an option for notebooks based on
Montevina in 2008. Echo Peak incorporates advanced MIMO antenna technology for
increased data throughput rates — for users of broadband at home, work and “on
the go.” A number of OEMs, including Acer, Asus, Lenovo, Panasonic and Toshiba
have apparently expressed intent to embed WiMAX into these next-generation
Centrino processor technology-based notebook PCs in 2008.

Making his presentation, Gadi Singer, Intel VP and AGM, Ultra Mobility Group,
discussed the growing need of mobile users to communicate, entertain, stay
informed and remain productive on the go. He also outlined Intel's strategy to
bring the full Internet for mobile users by using low power IA platforms, to
reduce CPU and chipset power performance.

Singer discussed the upcoming Intel Menlow platform, scheduled for launch in
the first half of 2008 which is comprised of a processor, codenamed 'Silverthorne',
based on a new 45nm hi-k low power micro-architecture and a new chipset,
codenamed “Poulsbo,” based on a ground-up single-chip design. He said that a
Menlow platform would deliver better performance at low power and could fit in a
74mm x 143mm sized motherboard, enabling a full Internet experience even though
the form factor is small enough to fit into users' pockets. Singer said that
Silverthorne draws 10x lower power compared to today's lower power processors
(based on pre-silicon estimates). He also discussed standardized communications
options such as Wi-Fi, 3G and WiMAX for MIDs and UMPCs, thus enabling connected
experiences.