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Follow UsSun Microsystems and Texas Instruments (TI) are working together to deliver optimized end-to-end wireless solutions for 2.5G and 3G networks. These solutions will available in the second quarter of 2004.
| JAVA ON THE MOVE | |
| l | Providing wireless solutions for 2.5G and 3G networks from Q2 2004 |
| l | These are targeted at OEMs, wireless operators and applications developers |
| l | TI to offer complete GPRS chipsets and handset reference designs by Q2 2004 |
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The initiative will help increase the demand for converged voice and multimedia wireless devices, creating revenue-generating opportunities for OEMs, wireless operators and applications developers.
“Widespread deployment of compelling new applications based on open standards-based platforms will drive consumer demand for 2.5G and 3G wireless handsets and services,” said Rick Kornfeld, VP and GM of TI´s Wireless Chipset Business Unit.
As part of this collaboration, TI licensed Sun´s Connected Limited Device Configuration HotSpot Implementation (CLDC HI) for integration into its family of TCS chipsets for GSM/GPRS, EDGE, CDMA and UMTS-enabled handsets and wireless OMAP applications processors.
DQCI NEWS BUREAU